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LM385M-2.5

NS LM385M-2.5

分流器固定0°C ~ 70°C(TA)

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LM385M-2.5
TWO TERMINAL VOLTAGE REFERENCE,
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¥0.63

价格更新:一个月前

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产品详情

Overview

The LM385M/NOPB is IC VREF SHUNT ADJ 8SOIC, that includes LM385-ADJ Series, they are designed to operate with a Tube Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.005044 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 8-SOIC (0.154", 3.90mm Width), it has an Operating Temperature range of 0°C ~ 70°C (TA), the device can also be used as Surface Mount Mounting Type. In addition, the Output Type is Adjustable, the device is offered in 8-SOIC Supplier Device Package, the device has a ±2% of Tolerance, and Current Output is 20mA, and the Reference Type is Shunt, and Voltage Output Min Fixed is 1.24V, and the Voltage Output Max is 5.3V, and Temperature Coefficient is 150ppm/°C, and the Noise 10Hz to 10kHz is 50μVrms, and Current Cathode is 55μA, it has an Maximum Operating Temperature range of + 70 C, it has an Minimum Operating Temperature range of 0 C, and the Output Voltage is 1.24 V to 5.3 V, and Initial Accuracy is 2 %, and the Shunt Current Max is 20 mA, and Maximum Output Voltage is 5.3 V, and the Shunt Current Min is 10 uA.

LM385M1.2 with EDA / CAD Models manufactured by NS. The LM385M1.2 is available in SOP-8 Package, is part of the IC Chips.

Features

Bulk Package
Shunt Reference Type
Fixed Output Type
2.5V Voltage - Output (Min/Fixed)
20 mA Current - Output
±3% Tolerance
150ppm/°C Temperature Coefficient
120µVrms Noise - 10Hz to 10kHz
20 µA Current - Cathode
0°C ~ 70°C (TA) Operating Temperature
Surface Mount Mounting Type
产品属性
全选
包装: 散装
部件状态: 在售
参考类型: 分流器
输出类型: 固定
最低/固定输出电压: 2.5V
电流 - 输出: 20 mA
容差: ±3%
温度系数: 150ppm/°C
10Hz 至 10kHz 范围内的噪声: 120µVrms
阴极电流: 20 µA
工作温度: 0°C ~ 70°C(TA)
安装类型: 表面贴装型
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商器件封装: 8-SOIC
National Semiconductor

National Semiconductor

National Semiconductor是一家著名的模拟半导体制造商,成立于1959年,总部位于美国加利福尼亚州圣克拉拉。2011年,National Semiconductor被德州仪器(Texas Instruments)收购,进一步增强了其在模拟半导体市场的领导地位。

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