Maxim DS34T108GN

TDM（分时复用）数据传输484-BGA 裸露焊盘

Overview

The DS34T104GN is IC TDM/PACKET CHIP 484-BGA, that includes DS34T104GN Series, they are designed to operate with a TDM-over-Packets Product, Type is shown on datasheet note for use in a TDM (Time Division Multiplexing), that offers Packaging features such as Tray, Mounting Style is designed to work in SMD/SMT, as well as the 484-BGA Package Case, the device can also be used as Surface Mount Mounting Type. In addition, the Applications is Data Transport, the device is offered in 4 Channel Number of Channels, the device has a 484-TEBGA (23x23) of Supplier Device Package, and Data Rate is 51.84 Mbps, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and the Operating Supply Voltage is 1.8 V 3.3 V, and Part # Aliases is 90-34T10-4N0, and the Supply Voltage Max is 1.89 V 3.465 V, and Supply Voltage Min is 1.71 V 3.135 V.

DS34T108 with circuit diagram manufactured by DALLAS. The DS34T108 is available in BGA Package, is part of the Specialized ICs.

Features

Tray Package
Applications : Data Transport

Surface Mount Mounting Type

Applications

There are a lot of Maxim Integrated
DS34T108GN+ Specialized ICs applications.

• MP3 Players
• Secure Download and Boot
• Ecosystem Control
• Anti-cloning
• Message Security
• µP Switch Interfacing
• Industrial Instruments
• PC-Based Instruments
• Portable Instruments
• Membrane Keypads