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MIR-100RK-SR3-G-NA-B-0-T

MACOM MIR-100RK-SR3-G-NA-B-0-T

100 欧姆±2%

比较
MIR-100RK-SR3-G-NA-B-0-T
RES SMD 100K OHM 2% 0202
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¥9.89

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The 1SR159-200TE25 is DIODE GEN PURP 200V 1A PMDS, that includes Tape & Reel (TR) Packaging, they are designed to operate with a DO-214AC, SMA Package Case, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Supplier Device Package features such as PMDS, Speed is designed to work in Fast Recovery = 200mA (Io), as well as the Standard Diode Type, the device can also be used as 10μA @ 200V Current Reverse Leakage Vr. In addition, the Voltage Forward Vf Max If is 980mV @ 1A, the device is offered in 200V Voltage DC Reverse Vr Max, the device has a 1A of Current Average Rectified Io, and Reverse Recovery Time trr is 50ns, it has an Operating Temperature Junction range of 150°C (Max).

1SR159-400TE25 with EDA / CAD Models manufactured by ROHM. The 1SR159-400TE25 is available in SMA Package, is part of the IC Chips.

Features

MIR Series
Tray Package
100 kOhms Resistance
±2% Tolerance
Thick Film Composition
RF, High Frequency Features
±150ppm/°C Temperature Coefficient
0202 (0505 Metric) Package / Case
0202 Supplier Device Package
0.020" L x 0.020" W (0.50mm x 0.50mm) Size / Dimension
0.010" (0.26mm) Height - Seated (Max)
2 Number of Terminations
产品属性
全选
型号系列: 米尔
包装: 托盘
部件状态: 在售
电阻: 100 欧姆
容差: ±2%
成分: 厚膜
特性: 射频、高频
温度系数: ±150ppm/℃
封装/外壳: 0202(0505 公制)
供应商器件封装: 0202号
尺寸/尺寸: 0.020 英寸长 x 0.020 英寸宽(0.50 毫米 x 0.50 毫米)
最大座位高度: 0.010 英寸(0.26 毫米)
端子数: 2
MACOM Technology Solutions

MACOM Technology Solutions

MACOM Technology Solutions 是一家专注于设计和制造高性能 RF(射频)、微波、毫米波和光学半导体产品的公司,成立于1950年,总部位于美国马萨诸塞州洛厄尔。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

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博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

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