MACOM MAT10010

1dB0 Hz ~ 20 GHz

Overview

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground bonding ribbon is not required. The chips may be attached using conductive epoxy or solder preform. Gold contacts on the input and output pads make assembly, using standard bonding equipment, fast and reliable. Custom values and configuration available on request.

Features

Tray Package
Type of FIXED ATTENUATOR

Die Package / Case

Applications

There are a lot of M/A-Com Technology Solutions
MAT10010 Attenuators applications.

• Test Equipment
• Sensors
• GSM
• WCDMA
• TD-SCDMA
• Optical transmission devices
• Measuring for data transmission
• Radio communication equipment
• Measuring instruments
• Cellular infrastructure