MACOM MADP-000402-12530P

PIN - 单100V250 mA0.06pF @ 40V, 1MHz1 W175°C（TJ）

Overview

This device is a Silicon-Glass PIN diode chipfabricated with MACOM's patentedHMICTM process. This device features twosilicon pedestals embedded in a low loss, low dispersionglass. The diode is formed on the top of onepedestal and connections to the backside of the deviceare facilitated by making the pedestal sidewallselectrically conductive. Selective backsidemetallization is applied producing a surface mountdevice. This vertical conic topology provides forexceptional heat transfer from the active area. Thetopside is fully encapsulated with silicon nitride andhas an additional polymer layer for scratch andimpact protection. These protective coatings preventdamage to the junction and the anode air-bridgeduring handling and assembly.These surmount devices are suitable for usage inmoderate incident power (5W C.W.) or higherincident peak power (50W) series, shunt, orseries-shunt switches. Lower parasitic inductance,0.45nH, and excellent RC constant (0.23pS), makethe devices ideal for higher frequency switchelements compared to their plastic devicecounterparts.

Features

MADP000402 Surmount™ Series
Tape & Reel (TR) Package
100V Voltage - Peak Reverse (Max)
250 mA Current - Max
0.06pF @ 40V, 1MHz Capacitance @ Vr, F
1 W Power Dissipation (Max)
175°C (TJ) Operating Temperature
Die Package / Case
Die Supplier Device Package