MACOM MADP-000235-10720T

PIN - 单35V1.5 A1.2pF @ 10V, 1MHz500 毫欧 @ 10mA，100MHz7.5 W-55°C ~ 150°C（TA）

Overview

The MADP-000235-10720T is a surface mount PINdiode in a non-magnetic Metal Electrode LeadlessFaced (MELF) package. The MADP-000235-10720Tis manufactured using MACOM's time proven HIPAX technology. The result is a low inductance ceramic package with no ribbonsor wires. The package utilizes a unique non-magneticplating process that provides for a hermetically sealedcomponent that has extremely low electromagneticpermeability. Incorporated in the package is a glasspassivated CERMA chip that is full face bonded onthe cathode and anode which maximizes the surfacecontact area to minimize the electrical and thermalresistances. The chip and package have been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance.The MADP-000235-10720T is designed for circuitprotection and the tuning of RF coil designs in MRIapplications. When connected in an anti-parallelconfiguration these PIN diodes provide excellentprotection from long RF pulses and spikes.

Features

Tape & Reel (TR) Package

7.5 W Power Dissipation (Max)

Applications

There are a lot of M/A-Com Technology Solutions
MADP-000235-10720T applications of RF diodes.

• Diode ring mixer
• RF detector
• RF voltage doubler
• Wearables
• Smart metering
• Set top boxes
• RF attenuators and switches
• Low-loss, high-power limiters
• Receiver protectors
• UHF mixer