MACOM MA4SW310B-1

通用反射

Overview

The MA4SW210B-1 and MA4SW310B-1devices are SP2T and SP3T broadbandswitches with an integrated bias networksutilizing MACOM's HMIC™ (Heterolithic Microwave IntegratedCircuit) process, US Patent 5,268,310. Thisprocess allows the incorporation of siliconpedestals that form series and shunt diodes orvias by imbedding them in low loss, lowdispersion glass. By using small spacingbetween circuit elements, this combinationof silicon and glass gives HMIC™ devices lowloss and high isolation performance withexceptional repeatability through low millimeterfrequencies.Large bond pads facilitate the use of lowinductance ribbon bonds, while full area, gold,backside metallization allows for manual orautomatic chip bonding via 80Au/20Sn soldersor electrically conductive silver epoxy.

Features

HMIC™ Series
Tray package
USABLE TO 26 GHZ, HIGH ISOLATION
General Purpose RF Type

Die Supplier Device Package

Applications

There are a lot of M/A-Com Technology Solutions
MA4SW310B-1 RF Switches applications.

• Dual-band applications
• High speed filter selection
• Digital transceiver front end switch
• IF switching
• Tuner modules
• Antenna diversity switching
• Cellular/PCS Base Stations
• ISM
• Wireless Local Loop
• Smartphones