MACOM CMPA1H1J050F-AMP

场效应晶体管17.3GHz～19.2GHzCMPA1H1J050F

Overview

The 05-0518-10H is CONN SOCKET SIP 5POS GOLD, that includes 518 Series, they are designed to operate with a SIP Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, as well as the Open Frame Features, the device can also be used as Polyamide (PA46), Nylon 4/6, Glass Filled Housing Material. In addition, the Number of Positions or Pins Grid is 5 (1 x 5), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Gold of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Tin, and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 200μin (5.08μm), and the Contact Material Post is Brass.

The 05-0518-11H is CONN SOCKET SIP 5POS GOLD, that includes Through Hole Mounting Type, they are designed to operate with a Solder Termination, Type is shown on datasheet note for use in a SIP, that offers Housing Material features such as Polyamide (PA46), Nylon 4/6, Glass Filled, Features is designed to work in Open Frame, as well as the Gold Contact Finish Mating, the device can also be used as Gold Contact Finish Post. In addition, the Packaging is Bulk, the device is offered in Brass Contact Material Post, the device has a Beryllium Copper of Contact Material Mating, and Series is 518, and the Number of Positions or Pins Grid is 5 (1 x 5), and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Finish Thickness Post is 10μin (0.25μm), and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm).

Features

Bulk Package
MOSFET Type
17.3GHz ~ 19.2GHz Frequency
CMPA1H1J050F For Use With/Related Products
Board(s) Supplied Contents