Intersil HSP50016JC-75

手机，AMPS，NA，TDMA，GSM，CDMA

Overview

The HSP-5 is THERMAL PAD 3-PHASE W/ADHESIVE, that includes Black Color, they are designed to operate with a HSP Series, Type is shown on datasheet note for use in a Thermal Pad, that offers Packaging features such as Bulk, it has an Operating Temperature Range range of - 60 C to + 180 C, as well as the UL 94 V-0 Flammability Rating, the device can also be used as 104.1 mm Length. In addition, the Width is 73.7 mm, the device is offered in Rectangle Shape, the device has a 0.0050" (0.127mm) of Thickness, and Outline is 104.39mm x 73.66mm, and the Adhesive is Adhesive - One Side, and Usage is Three Phase SSRs, and the Tensile Strength is 25 psi, and Thermal Conductivity is 2.0 W/m-K.

The HSP50016JC-52 is RF Mixer IC Cellular, AMPS, NA, TDMA, GSM, CDMA 44-PLCC (16.58x16.58) manufactured by INTERSIL. The HSP50016JC-52 is available in PLCC Package, is part of the IC Chips, , and with support for RF Mixer IC Cellular, AMPS, NA, TDMA, GSM, CDMA 44-PLCC (16.58x16.58).

Features

HSP50016 Series
Bulk Package
Cellular, AMPS, NA, TDMA, GSM, CDMA RF Type
Surface Mount Mounting Type