Intersil HC55185AIM

用户线路接口概念（SLIC）

Overview

• Onboard Ringing Generation• Compatible with Existing HC5518x Devices• Low Standby Power Consumption (75V, 65mW)• Reduced Idle Channel Noise• Programmable Transient Current Limit• Improved Off Hook Software Interface• Integrated MTU DC Characteristics• Low External Component Count• Silent Polarity Reversal• Pulse Metering and On Hook Transmission• Tip Open Ground Start Operation• Balanced and Unbalanced Ringing• Thermal Shutdown with Alarm Indicator• 28 Lead Surface Mount Packaging• Reduced Footprint Micro Leadframe Packaging• Dielectric Isolated (DI) High Voltage Design• QFN Package Option- Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Product Outline- Near Chip Scale Package Footprint; Improves PCB efficiency and has a thinner profile• Pb-free plus anneal available (RoHS compliant)• Voice Over Internet Protocol (VoIP)• Cable Modems• Voice Over DSL (VoDSL)• Short Loop Access Platforms• Remote Subscriber Units• Terminal Adapters Related Literature• AN9814, User’s Guide for Development Board• AN9824, Modeling of the AC Loop• Interfacing to DSP CODECs (Contact Factory)• TB379 Thermal Characterization of Packages for ICs• AN9922, Thermal Characterization and Modeling of the RSLIC18 in the Micro Leadframe Package

Features

RSLIC18 Series
Available in the 28-LCC (J-Lead) package

Surface Mount Mounting Type

Applications

There are a lot of Rochester Electronics, LLC
HC55185AIM Telecom applications.

• BITS Timing
• Digital Access Cross-connect System (DACs)
• Digital Cross-connect Systems (DCS)
• Frame Relay Switches and Access Devices (FRADS)
• ISDN Primary Rate Interfaces (PRA)
• PBXs channel bank
• PCM channel bank
• T3 channelized access concentrators
• M13 MUX
• Wireless base stations