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TS80C51RA1

Intel TS80C51RA1

MCS 5116MHz

比较
Intel
TS80C51RA1
IC MCU 8BIT ROMLESS 44QFP
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比较

¥19.47

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

TS80C32X2-VIC with pin details, that includes 80C Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 44-QFP, it has an Operating Temperature range of -40°C ~ 85°C (TA), Number of I O is designed to work in 32, as well as the 60/30MHz Speed, the device can also be used as 80C51 Core Processor. In addition, the RAM Size is 256 x 8, the device is offered in ROMless Program Memory Type, the device has a POR of Peripherals, and Connectivity is UART/USART, and the Voltage Supply Vcc Vdd is 4.5 V ~ 5.5 V, and Core Size is 8-Bit, and the Oscillator Type is Internal.

The TS80C51FA1SF88 is IC MCU 8BIT EXT 44MQFP, that includes SIO Connectivity, they are designed to operate with a MCS 51 Core Processor, Core Size is shown on datasheet note for use in a 8-Bit, that offers Number of I O features such as 32, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the External Oscillator Type, the device can also be used as 44-QFP Package Case. In addition, the Packaging is Tray, the device is offered in PWM, WDT Peripherals, the device has a ROMless of Program Memory Type, and RAM Size is 256 x 8, and the Series is 80C, and Speed is 16MHz, and the Voltage Supply Vcc Vdd is 4.5 V ~ 5.5 V.

Features

80C Series
44-QFP package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of Intel
TS80C51RA1 Microcontroller applications.

  • Equipment control
  • Instrument control
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
产品属性
全选
型号系列: 80C
包装: 托盘
部件状态: 停产
可编程: 未验证
核心处理器: MCS 51
内核规格: 8 位
速度: 16MHz
连接能力: SIO
外设: WDT
输入/输出数量: 32
程序存储器类型: ROMless
RAM 大小: 512 x 8
电源电压(Vcc/Vdd): 4V ~ 6V
振荡器类型: 外部
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 44-QFP
Intel

Intel

Intel Corporation是一家全球领先的半导体公司,成立于1968年,总部位于美国加利福尼亚州圣克拉拉。Intel以其创新的处理器技术和半导体解决方案著称,广泛应用于计算机、数据中心、物联网和通信设备等领域。

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