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NU80579EZ009C

Intel NU80579EZ009C

Intel® EP80579 Integrated Processor1.2GHzDDR210/100/1000Mbps(1)95°C (TC)

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Intel
NU80579EZ009C
INTEL EP80579 INTEGRATED PROCESS
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¥210.00

价格更新:一个月前

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产品详情

Overview

The NU80579EZ004C is MPU EP80579 Integrated Processor RISC 32bit 90nm 1.066GHz 1.2V/1.8V/2.5V/3.3V 1088-Pin FCBGA, that includes Surface Mount Mounting, they are designed to operate with a 1066 Maximum Speed MHz, it has an Minimum Operating Temperature °C range of 0, it has an Maximum Operating Temperature °C range of 70, Interface Type is designed to work in Ethernet/SPI/UART/USB, as well as the 1088 PCB changed, the device can also be used as BGA Standard Package Name. In addition, the Supplier Package is FCBGA, the device is offered in 1088 Pin Count, the device has a Ball of Lead Shape, and Data Bus Width bit is 32, and the Instruction Set Architecture is RISC, and Fabrication Technology is 90nm, and the Number of CPU Cores is 1, and Maximum Operating Supply Voltage V is 1.326, and the Instruction Cache Size is 32KB, and Data Cache Size is 32KB, and the Minimum Operating Supply Voltage V is 1.274, and Multiply Accumulate is Yes, and the Typical Operating Supply Voltage V is 1.3, and Package Height mm is 3.78(Max), and the Package Length mm is 37.55(Max), and Package Width mm is 37.55(Max).

NU80579ED009C with circuit diagram manufactured by INTEL. The NU80579ED009C is available in BGA Package, is part of the IC Chips.

Features

Tray Package
Intel® EP80579 Integrated Processor Core Processor
1.2GHz Speed
DDR2 RAM Controllers
No Graphics Acceleration
10/100/1000Mbps (1) Ethernet
SATA (2) SATA
USB 2.0 (2) USB
95°C (TC) Operating Temperature
Surface Mount Mounting Type
产品属性
全选
包装: 托盘
部件状态: 在售
核心处理器: Intel® EP80579 Integrated Processor
每总线宽度内核数: 1 核,32 位
速度: 1.2GHz
RAM 控制器: DDR2
图形加速: 无
以太网: 10/100/1000Mbps(1)
SATA(串行 ATA): SATA(2)
USB(通用串行总线): USB 2.0(2)
工作温度: 95°C (TC)
安装类型: 表面贴装型
封装/外壳: 1088-BGA, FCBGA
供应商器件封装: 1088-FCBGA (37.5x37.5)
Intel

Intel

Intel Corporation是一家全球领先的半导体公司,成立于1968年,总部位于美国加利福尼亚州圣克拉拉。Intel以其创新的处理器技术和半导体解决方案著称,广泛应用于计算机、数据中心、物联网和通信设备等领域。

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