
Intel LPM25P2F266B
奔腾 II266MHzSDRAM
比较






¥2154.13
价格更新:一个月前博斯克质量保证







Overview
The 266M2 is XFRMR LAMINATED 7.5VA CHAS MOUNT, that includes 266 Series, they are designed to operate with a Laminated Core Type, Termination Style is shown on datasheet note for use in a Wire Leads, that offers Mounting Type features such as Chassis Mount, Size Dimension is designed to work in 71.63mm L x 42.93mm W, as well as the Parallel 6A, Series 3A Current Output Max, the device can also be used as 7.5 VA Power Max. In addition, the Voltage Isolation is 2000Vrms, the device is offered in 42.93mm Height Seated Max, the device has a 117V, 234V of Voltage Primary, and Voltage Secondary Full Load is Parallel 1.25V, Series 2.5V, and the Primary Winding s is Dual, and Secondary Winding s is Dual, and the Center Tap is No.
The 266M24 is XFRMR LAMINATED 72VA CHAS MOUNT, that includes No Center Tap, they are designed to operate with a Parallel 6A, Series 3A Current Output Max, Height Seated Max is shown on datasheet note for use in a 66.80mm, that offers Mounting Type features such as Chassis Mount, Power Max is designed to work in 72 VA, as well as the Dual Primary Winding s, the device can also be used as Dual Secondary Winding s. In addition, the Series is 266, the device is offered in 102.36mm L x 63.50mm W Size Dimension, the device has a Wire Leads of Termination Style, and Type is Laminated Core, and the Voltage Isolation is 2000Vrms, and Voltage Primary is 117V, 234V, and the Voltage Secondary Full Load is Parallel 12V, Series 24V.
Features
Bulk PackagePentium II Core Processor
1 Core Number of Cores/Bus Width
266MHz Speed
SDRAM RAM Controllers
443BX Display & Interface Controllers
3.3V Voltage - I/O
Surface Mount Mounting Type
Module Package / Case
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Intel
Intel Corporation是一家全球领先的半导体公司,成立于1968年,总部位于美国加利福尼亚州圣克拉拉。Intel以其创新的处理器技术和半导体解决方案著称,广泛应用于计算机、数据中心、物联网和通信设备等领域。
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博斯克数字
收入: 85M
2022年的收入为8500万美元,与2021年增长63%。
国家: 105
博斯克服务全球105个国家的客户。
配件发货: 25M+
我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。
制造商: 950
2022年,博斯克从近950个制造商售卖了配件。
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