联系我们
中文
AGIB023R18A2I3V

Intel AGIB023R18A2I3V

MPU,FPGA带 CoreSight™ 的四核 ARM® Cortex®-A53 MPCore™,ARM NEON,浮点256KBDMA,WDTEBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG1.4GHz

比较
Intel
AGIB023R18A2I3V
IC FPGA AGILEX-I 1805FBGA
无数据表
paypalvisamastercarddiscover
upsdhlsf
比较

¥173555.03

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

The 182-025-113R161 is CONN D-SUB PLUG 25POS R/A SOLDER, that includes 182 Series, they are designed to operate with a Plug Type, Packaging is shown on datasheet note for use in a Tray, that offers Current Rating features such as 5 A, Termination Style is designed to work in Through Hole, as well as the Solder Termination, the device can also be used as Through Hole, Right Angle Mounting Type. In addition, the Features is Ground Strap, Grounding Indents, the device is offered in Plug, Male Pins Connector Type, the device has a Gold of Contact Finish, and Shell Size is 3 (B), and the Shell Plating is Nickel, and Contact Finish Thickness is Flash, and the Number of Positions is 25, and Number of Rows is 2, and the Connector Style is D-Sub, and Gender is Male, and the Contact Type is Signal, and Flange Feature is Housing/Shell (Unthreaded), and the Shell Material Finish is Steel, Nickel Plated, and Shell Size Connector Layout is 3 (DB, B), and the Contact Plating is Gold, and Mounting Angle is Right, and the Contact Gender is Pin (Male).

182-025-112-561 with circuit diagram, that includes D-Sub Connector Style, they are designed to operate with a Plug, Male Pins Connector Type, Contact Finish is shown on datasheet note for use in a Gold, that offers Contact Finish Thickness features such as Flash, Contact Type is designed to work in Signal, as well as the Board Lock, Grounding Indents Features, the device can also be used as Mating Side, Female Screwlock (4-40) Flange Feature. In addition, the Mounting Type is Through Hole, Right Angle, the device is offered in 25 Number of Positions, the device has a 2 of Number of Rows, and Series is 182, and the Shell Material Finish is Steel, Tin Plated, and Shell Size Connector Layout is 3 (DB, B), and the Termination is Solder.

Features

Agilex I Series
Tray Package
MPU, FPGA Architecture
256KB RAM Size
DMA, WDT Peripherals
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Connectivity
1.4GHz Speed
产品属性
全选
型号系列: Agilex I
包装: 托盘
部件状态: 在售
系统架构: MPU,FPGA
核心处理器: 带 CoreSight™ 的四核 ARM® Cortex®-A53 MPCore™,ARM NEON,浮点
内存大小: 256KB
外围设备: DMA,WDT
连接性: EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
速度: 1.4GHz
主要属性: FPGA - 2.3M 逻辑元件
工作温度: -40°C ~ 100°C(TJ)
包装 / 盒: 1805-BBGA 裸露焊盘
供应商 设备封装: 1805-BGA(42.5x42.5)
Intel

Intel

Intel Corporation是一家全球领先的半导体公司,成立于1968年,总部位于美国加利福尼亚州圣克拉拉。Intel以其创新的处理器技术和半导体解决方案著称,广泛应用于计算机、数据中心、物联网和通信设备等领域。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

所有产品零件号 0 - Z