Intel AGFC023R25A2E4X

MPU，FPGA带 CoreSight™ 的四核 ARM® Cortex®-A53 MPCore™，ARM NEON，浮点256KBDMA，WDTEBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG1.4GHz

Overview

The FCN1913H683J-E2 is CAP FILM 0.068UF 5% 50VDC 1913, that includes FCN Series, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a 1913 (4833 Metric), that offers Capacitance features such as 0.068μF, Termination is designed to work in Solder Pads, it has an Operating Temperature range of -55°C ~ 105°C, the device can also be used as Surface Mount Mounting Type. In addition, the Size Dimension is 0.189" L x 0.130" W (4.80mm x 3.30mm), the device is offered in General Purpose Applications, the device has a ±5% of Tolerance, and Height Seated Max is 0.087" (2.20mm), and the Dielectric Material is Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked, and Voltage Rating AC is 40V, and the Voltage Rating DC is 50V.

FCN1913H823J with EDA / CAD Models, that includes Surface Mount Mounting Type, they are designed to operate with a Solder Pads Termination, Dielectric Material is shown on datasheet note for use in a Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked, that offers Applications features such as General Purpose, Series is designed to work in FCN, as well as the Bulk Packaging, it has an Operating Temperature range of -55°C ~ 105°C. In addition, the Voltage Rating DC is 50V, the device is offered in 40V Voltage Rating AC, the device has a 1913 (4833 Metric) of Package Case, and Size Dimension is 0.189" L x 0.130" W (4.80mm x 3.30mm), and the Height Seated Max is 0.087" (2.20mm), and Capacitance is 0.082μF, and the Tolerance is ±5%.

Features

Agilex F Series
Tray Package
MPU, FPGA Architecture
256KB RAM Size
DMA, WDT Peripherals
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Connectivity
1.4GHz Speed
0°C ~ 100°C (TJ) Operating Temperature