
Intel AGFB014R24B2E2V
MPU,FPGA带 CoreSight™ 的四核 ARM® Cortex®-A53 MPCore™,ARM NEON,浮点256KBDMA,WDTEBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG1.4GHz
比较






¥80794.94
价格更新:一个月前博斯克质量保证







Overview
The AGF700-48S30LT is DC/DC CONVERTER 30V 700W, that includes AGF700 Series, they are designed to operate with a Isolated Product, Type is shown on datasheet note for use in a Isolated Module, that offers Packaging features such as Bulk, Mounting Style is designed to work in Chassis, it has an Operating Temperature Range range of - 40 C to + 85 C, the device can also be used as 0.5 in Height. In addition, the Length is 2.4 in, the device is offered in 4.6 in Width, the device has a Full Brick of Package Case, it has an Operating Temperature range of -40°C ~ 85°C, and the Mounting Type is Through Hole, and Features is Remote On/Off, OCP, OTP, OVP, and the Size Dimension is 4.60" L x 2.40" W x 0.50" H (116.8mm x 61.0mm x 12.7mm), and Applications is ITE (Commercial), and the Number of Outputs is 1, and Current Output Max is 25A, and the Voltage Input Min is 36V, and Voltage Input Max is 75V, and the Output Power is 700 W, and Voltage Output 1 is 30V, and the Efficiency is 0.93, and Power Watts Manufacture Series is 700W, and the Dimensions is 2.4 in x 4.6 in x 0.5 in, and Input Voltage is 36 V to 75 V, and the Output Voltage Channel 1 is 30 V, and Output Current Channel 1 is 25 A, and the Commercial Medical is Commercial, and Package Case Size is Full Brick.
AGF800-48S48 with EDA / CAD Models, that includes Tray Packaging, they are designed to operate with a Through Hole Mounting Type, Features is shown on datasheet note for use in a OTP, OVP, that offers Applications features such as ITE (Commercial), Type is designed to work in Isolated Module, as well as the AGF800 Series, the device can also be used as 800W Power Watts Manufacture Series. In addition, the Voltage Input Max is 75V, the device is offered in 48V Voltage Output 1, it has an Operating Temperature range of -40°C ~ 85°C, and Size Dimension is 4.60" L x 2.40" W x 0.50" H (116.8mm x 61.0mm x 12.7mm), and the Voltage Input Min is 36V, and Current Output Max is 16.7A, and the Package Case is 14-DIP Module, Full Brick, and Voltage Isolation is 1.5kV (1500V), and the Number of Outputs is 1, and Efficiency is 0.945.
Features
Agilex F SeriesTray Package
MPU, FPGA Architecture
256KB RAM Size
DMA, WDT Peripherals
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Connectivity
1.4GHz Speed
0°C ~ 100°C (TJ) Operating Temperature
- 起步价为$40,南非、巴西、印度、巴基斯坦、以色列等国家的价格会有所变动,详情请咨询相关客服人员。
- 包裹重量≤0.5kg的基本运费根据时区和国家而定。
- 我们的产品目前使用DHL,顺丰和UPS运输。如果数量少,则选择联邦快递。
- 一旦发货,预期交货时间跟选择的运输方式有所变动。
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Intel
Intel Corporation是一家全球领先的半导体公司,成立于1968年,总部位于美国加利福尼亚州圣克拉拉。Intel以其创新的处理器技术和半导体解决方案著称,广泛应用于计算机、数据中心、物联网和通信设备等领域。
热门零件号
实时新闻
博斯克数字
收入: 85M
2022年的收入为8500万美元,与2021年增长63%。
国家: 105
博斯克服务全球105个国家的客户。
配件发货: 25M+
我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。
制造商: 950
2022年,博斯克从近950个制造商售卖了配件。
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