Intel AGFA023R24C2E1VB

MPU，FPGA带 CoreSight™ 的四核 ARM® Cortex®-A53 MPCore™，ARM NEON，浮点256KBDMA，WDTEBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG1.4GHz

Overview

The 3-87977-9 is 28 MODIV HSG COMP DR .100 POL, that includes Black Color, they are designed to operate with a AMPMODU Mod IV Series, Packaging is shown on datasheet note for use in a Bulk, that offers Mounting Type features such as Free Hanging (In-Line), Connector Type is designed to work in Receptacle, as well as the Crimp Contact Termination, the device can also be used as 28 Number of Positions. In addition, the Pitch is 0.100" (2.54mm), the device is offered in 2 Number of Rows, the device has a Female Socket of Contact Type, and Row Spacing is 0.100" (2.54mm).

The 387AS15 is LAMP T1 3/4 INCAND FLANGE, more 387AS15 informations to contact Tech-supports team please.

Features

Agilex F Series
Tray Package
MPU, FPGA Architecture
256KB RAM Size
DMA, WDT Peripherals
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Connectivity
1.4GHz Speed
0°C ~ 100°C (TJ) Operating Temperature