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85314AMI-11LF

IDT 85314AMI-11LF

扇出缓冲器(分配),多路复用器11:5

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85314AMI-11LF
IC CLK BUFFER 1:5 700MHZ 20SOIC
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产品详情

Overview

The 8-531341-0 is CONN CARD EDGE 28POS AU VERT PCB, that includes Black Color, they are designed to operate with a Standard Edge II Series, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 85°C, as well as the Through Hole Mounting Type, the device can also be used as Phosphor Bronze Contact Material. In addition, the Contact Finish is Gold, the device is offered in 30μin (0.76μm) Contact Finish Thickness, the device has a 56 of Number of Positions, and Pitch is 0.125" (3.18mm), and the Number of Rows is 2, and Gender is Female, and the Card Thickness is 0.054" ~ 0.070" (1.37mm ~ 1.78mm), and Flange Feature is Top Mount Opening, Unthreaded, 0.128" (3.25mm) Dia, and the Card Type is Non Specified - Dual Edge.

The 8-53127-2 is CONN SPADE SPRING 12-10AWG SOLIS, that includes Brazed Seam, Serrated Termination Features, they are designed to operate with a Non-Insulated Insulation, Length Overall is shown on datasheet note for use in a 0.729" (18.52mm), that offers Mounting Type features such as Free Hanging (In-Line), Packaging is designed to work in Bulk Alternate Packaging, as well as the Solistrand Series, the device can also be used as 8 Stud Stud Tab Size. In addition, the Terminal Type is Spring, Snap, the device is offered in Crimp Termination, the device has a 0.375" (9.53mm) of Width Outer Edges, and Wire Gauge is 10-12 AWG.

Features

Tube Package
Fanout Buffer (Distribution), Multiplexer Type
1 Number of Circuits
1:5 Ratio - Input:Output
Yes/Yes Differential - Input:Output
HCSL, LVDS, LVHSTL, LVPECL, SSTL Input
LVPECL Output
700 MHz Frequency - Max
2.375V ~ 3.8V Voltage - Supply
Surface Mount Mounting Type
产品属性
全选
包装: 管件
部件状态: 停产
类型: 扇出缓冲器(分配),多路复用器
电路数: 1
输入输出比: 1:5
差分输入至输出: 是/是
输入: HCSL,LVDS,LVHSTL,LVPECL,SSTL
输出: LVPECL
频率 - 最大值: 700 MHz
电源电压: 2.375V ~ 3.8V
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
供应商器件封装: 20-SOIC
IDT, Integrated Device Technology Inc.

IDT, Integrated Device Technology Inc.

Integrated Device Technology Inc.(IDT)是一家专注于开发高性能混合信号半导体解决方案的公司,成立于1980年,总部位于美国加利福尼亚州圣何塞。IDT的产品广泛应用于通信、计算、消费电子和汽车市场。

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收入: 85M

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博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

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