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CYW20735PB1KML1G

Cypress CYW20735PB1KML1G

蓝牙v5.02.402GHz~2.48GHz12分贝

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CYW20735PB1KML1G
RF TXRX MODULE BLUETOOTH SMD
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¥28.30

价格更新:一个月前

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产品详情

Overview

Bluetooth portfolio consists of Bluetooth Low Energy (BLE)-only and dual-mode Bluetooth solution that supports Bluetooth Classic i.e. Basic Rate (BR) and Enhanced Data Rate (EDR) as well as BLE. Bluetooth Low Energy (BLE) portfolio consists of WICED SMART, PSoC 4 BLE and PSoC 6 BLE System-on-Chip (SoC) devices and System-in-Package (SiP) modules. The dual-mode Bluetooth portfolio includes Bluetooth 5.0 core specification-compliant, BR + EDR + BLE devices and modules that integrate Bluetooth standard profiles and protocols for embedded applications. All of Bluetooth Modules are fully integrated, fully certified, programmable modules designed for ease-of-use and reducing time-to-market.

The CYW20819 integrates Ultra-Low Power (ULP) BLE along with the capability to add audio functionality to enhance the user experience for wearables and trackers. It also provides best-in-class receiver sensitivity for both BLE and EDR. Using advanced design techniques and process technology to reduce active and idle power, the CYW20819 also addresses the needs of a diverse class of low power Bluetooth 5-enabled devices that require minimal power consumption and compact size.

Features

WICED Series
Tray Package
Bluetooth RF Family/Standard
Bluetooth v5.0 Protocol
GFSK Modulation
2.402GHz ~ 2.48GHz Frequency
2Mbps Data Rate
12dBm Power - Output
ADC, I2C, I2S, PCM, PWM, SPI, UART Serial Interfaces
Antenna Not Included Antenna Type
CYW20735B1 Utilized IC / Part
384kB RAM, 2MB ROM Memory Size
1.62V ~ 3.63V Voltage - Supply
8mA Current - Receiving
18mA Current - Transmitting
Surface Mount Mounting Type
产品属性
全选
型号系列: 世界环境与发展国际会议
包装: 托盘
部件状态: 不适用于新设计
可编程: 未经审核的
射频系列/标准: 蓝牙
协议: 蓝牙v5.0
调制: GFSK
频率: 2.402GHz~2.48GHz
数据速率: 2Mbps
输出功率: 12分贝
灵敏度: -94.5dBm
串行接口: ADC、I2C、I2S、PCM、PWM、SPI、UART
天线类型: 不包括天线
使用的 IC/零件: CYW20735B1
存储容量: 384kB RAM,2MB ROM
电源电压: 1.62V~3.63V
电流 - 接收: 8毫安
电流 - 传输: 18毫安
安装类型: 表面贴装
工作温度: -30℃~85℃
封装/外壳: 60-VFQFN 裸露焊盘
Cypress Semiconductor Corp

Cypress Semiconductor Corp

Cypress Semiconductor是一家知名的半导体公司,专注于高性能嵌入式系统解决方案。公司成立于1982年,总部位于美国加利福尼亚州圣何塞。Cypress的产品广泛应用于汽车、工业、消费电子和物联网市场。

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