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CYW20719B2KWB9GT

Cypress CYW20719B2KWB9GT

蓝牙 v5.12.4GHz5.5dBm

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CYW20719B2KWB9GT
RF TRANSCEIVER (BOARD MOUNT) TXR
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¥43.84

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

Cypress Semiconductor's CYW20719B1KUMLG wireless MCU is an ultra-low-power dual-mode Bluetooth 5.0-compliant device enabling a variety of IoT applications including wearables/fitness bands, home automation, blood pressure monitors/other medical devices, audio, and more. The CYW20719B1KUMLG device is manufactured using an advanced 40 nm CMOS low-power fabrication process. A CYW20719B1KUMLG evaluation kit is available to prototype IoT applications using the CYW20719B1KUMLG device as well as on-board sensors and other peripherals. The CYW20719B1KUMLG wireless MCU, as well as the EVK, are supported in WICED Studio 6.1 (and later) which provides application programming interfaces, code snippets, and demo applications to accelerate the development process. For more information, visit www.cypress.com/wiced and join the Cypress Developer Community for additional support.CYW20719B1KUMLG Product GuideThe CYW20719B1KUMLG Dual-Mode Bluetooth 5.0 EVK is an ideal development platform for prototyping IoT designs with industry-leading Bluetooth 5.0 connectivity. This kit features:Motion Sensor Example Project Using 9-Axis Sensor

Features

Tape & Reel (TR) Package
TxRx + MCU Type
Bluetooth RF Family/Standard
Bluetooth v5.1 Protocol
4DQPSK, 8DPSK, GFSK, QPSK Modulation
2.4GHz Frequency
3Mbps Data Rate (Max)
5.5dBm Power - Output
1MB Flash, 2MB ROM, 512kB RAM Memory Size
GPIO, HCI, I²C, I²S, PCM, PWM, SPI, UART Serial Interfaces
40 GPIO
1.76V ~ 3.63V Voltage - Supply
5.9mA Current - Receiving
5.6mA Current - Transmitting
Surface Mount Mounting Type
产品属性
全选
包装: 卷带(TR)
部件状态: 在售
可编程: 未验证
类型: TxRx + MCU
射频系列/标准: 蓝牙
协议: 蓝牙 v5.1
调制: 4DQPSK, 8DPSK, GFSK, QPSK
频率: 2.4GHz
最大数据传输速率: 3Mbps
输出功率: 5.5dBm
灵敏度: -95.5dBm
存储容量: 1MB 闪存,2MB ROM,512kB RAM
串行接口: GPIO,HCI,I²C,I²S,PCM,PWM,SPI,UART
GPIO(通用输入/输出): 40
电源电压: 1.76 V ~ 3.63 V
电流 - 接收: 5.9mA
电流 - 传输: 5.6mA
工作温度: -30°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 134-XFBGA, WLCSP
供应商器件封装: 134-WLCSP(3.31x3.22)
Cypress Semiconductor Corp

Cypress Semiconductor Corp

Cypress Semiconductor是一家知名的半导体公司,专注于高性能嵌入式系统解决方案。公司成立于1982年,总部位于美国加利福尼亚州圣何塞。Cypress的产品广泛应用于汽车、工业、消费电子和物联网市场。

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