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HSMW-C120

Broadcom HSMW-C120

白色160mcd3.6V

比较
HSMW-C120
LED COOL WHITE DIFF CHIP SMD R/A
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¥3.26

价格更新:一个月前

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产品详情

Overview

The HSMW-A400-U00M2 is LED COOL WHITE CLEAR 4PLCC SMD, that includes White, Cool Color, they are designed to operate with a Digi-ReelR Alternate Packaging Packaging, Mounting Style is shown on datasheet note for use in a SMD/SMT, that offers Package Case features such as 4-PLCC, Mounting Type is designed to work in Surface Mount, as well as the 3.20mm L x 2.80mm W Size Dimension, the device can also be used as 4-PLCC Supplier Device Package. In addition, the Orientation is Top View, the device is offered in 120° Viewing Angle, the device has a 3.8V of Voltage Forward Vf Typ, and Current Test is 30mA, and the Millicandela Rating is 700mcd, and Lens Style Size is Round with Flat Top, 2.20mm, and the Lens Color is Colorless, and Lens Transparency is Clear, and the Height Max is 2.10mm, it has an Maximum Operating Temperature range of + 100 C, it has an Minimum Operating Temperature range of - 40 C, and Vf Forward Voltage is 3.8 V, and the Illumination Color is White, and LED Size is 3.2 mm x 2.8 mm x 1.9 mm, and the If Forward Current is 30 mA, and Luminous Intensity is 700 mcd.

HSMW-C110 with circuit diagram manufactured by AVAGO. The HSMW-C110 is available in SMD Package, is part of the IC Chips.

Features

Tape & Reel (TR) Package
White Color
Standard Configuration
White Lens Color
Diffused Lens Transparency
160mcd Millicandela Rating
Rectangle with Domed Top Lens Style
1.20mm x 0.60mm Lens Size
3.6V Voltage - Forward (Vf) (Typ)
20mA Current - Test
155° Viewing Angle
Surface Mount, Right Angle Mounting Type
Chip LED Supplier Device Package
1.60mm L x 1.00mm W Size / Dimension
0.70mm Height (Max)
产品属性
全选
包装: 卷带(TR)
部件状态: 在售
颜色: 白色
配置: 标准
镜片颜色: 白色
透镜的透明度: 散射
毫烛光等级: 160mcd
镜头样式: 矩形,带圆顶
镜头尺寸: 1.20mm x 0.60mm
典型正向电压: 3.6V
电流 - 测试: 20mA
视角: 155°
安装类型: 表面贴装,直角
封装/外壳: 2-SMD,无引线
供应商器件封装: 片式 LED
尺寸/尺寸: 1.60mm 长 x 1.00mm 宽
最大高度: 0.70mm
Broadcom Limited

Broadcom Limited

Broadcom Limited是一家全球领先的半导体公司,专注于设计、开发和供应广泛的半导体和基础设施软件解决方案。公司总部位于美国加利福尼亚州圣何塞

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