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HSMP-3820-TR1

Broadcom HSMP-3820-TR1

PIN - 单50V1 A0.8pF @ 20V,1MHz600 毫欧 @ 10mA,100MHz150°C(TJ)

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HSMP-3820-TR1
RF DIODE PIN 50V SOT23-3
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¥7.84

价格更新:一个月前

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产品详情

Overview

The HSMP-3820-BLKG is DIODE PIN SWITCH 50V SOT-23, that includes Switch Type, they are designed to operate with a Bulk Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.050717 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in TO-236-3, SC-59, SOT-23-3, as well as the UHF Frequency Range, the device can also be used as SOT-23-3 Supplier Device Package. In addition, the Configuration is Single, the device is offered in PIN - Single Diode Type, the device has a 50V of Voltage Peak Reverse Max, and Capacitance Vr F is 0.8pF @ 20V, 1MHz, and the Current Max is 1A, and Resistance If F is 600 mOhm @ 10mA, 100MHz, it has an Maximum Operating Temperature range of + 150 C, it has an Minimum Operating Temperature range of - 65 C, and the Vr Reverse Voltage is 50 V, and If Forward Current is 1 A, and the Recovery Time is 7 ns, and Maximum Diode Capacitance is 0.8 pF at 20 V, and the Maximum Series Resistance Maximum IF is 0.6 Ohms at 10 mA, and Carrier Life is 0.07 us.

HSMP-3820 with circuit diagram manufactured by HP. The HSMP-3820 is available in SOT23 Package, is part of the RF Diodes.

Features

Tape & Reel (TR) Package
at its lowest breakdown voltage of 50V

150°C (TJ) Operating Temperature

Applications


There are a lot of Broadcom Limited
HSMP-3820-TR1 applications of RF diodes.

  • Radar systems for industrial use
  • Ultra high-speed switching
  • Clamping circuits
  • Diode ring mixer
  • RF detector
  • RF voltage doubler
  • Wearables
  • Smart metering
  • Set top boxes
  • RF attenuators and switches
产品属性
全选
包装: 卷带(TR)
部件状态: 停产
二极管类型: PIN - 单
最大峰值反向电压: 50V
电流 - 最大值: 1 A
Vr 时的电容,F: 0.8pF @ 20V,1MHz
正向电流时的电阻,频率: 600 毫欧 @ 10mA,100MHz
工作温度: 150°C(TJ)
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商器件封装: SOT-23-3
Broadcom Limited

Broadcom Limited

Broadcom Limited是一家全球领先的半导体公司,专注于设计、开发和供应广泛的半导体和基础设施软件解决方案。公司总部位于美国加利福尼亚州圣何塞

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