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HMPP-3892-TR1

Broadcom HMPP-3892-TR1

PIN - 2 个独立100V1 A0.3pF @ 5V,1MHz2.5 欧姆 @ 5mA,100MHz150°C(TJ)

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HMPP-3892-TR1
RF DIODE PIN 100V MINIPAK
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¥0.91

价格更新:一个月前

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产品详情

Overview

The HMPP-3890-TR2 is DIODE PIN SGL 100V 1A MINIPAK, that includes Switch Type, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Mounting Style is shown on datasheet note for use in a SMD/SMT, that offers Package Case features such as 0505 (1412 Metric), Frequency Range is designed to work in SHF, as well as the MiniPak 1412 Supplier Device Package, the device can also be used as Single Configuration. In addition, the Diode Type is PIN - Single, the device is offered in 100V Voltage Peak Reverse Max, the device has a 0.3pF @ 5V, 1MHz of Capacitance Vr F, and Current Max is 1A, and the Resistance If F is 2.5 Ohm @ 5mA, 100MHz, it has an Maximum Operating Temperature range of + 150 C, it has an Minimum Operating Temperature range of - 65 C, and Vr Reverse Voltage is 5 V, and the If Forward Current is 1 A, and Maximum Diode Capacitance is 0.3 pF at 5 V, and the Maximum Series Resistance Maximum IF is 2.5 Ohms at 5 mA, and Carrier Life is 0.2 us, and the Maximum Series Resistance Minimum IF is 3.8 Ohms at 1 mA.

HMPP-3890-TR1G with circuit diagram manufactured by AVAGO. The HMPP-3890-TR1G is available in MINIP Package, is part of the IC Chips.

Features

Tape & Reel (TR) Package
A resistance of 2.5Ohm

MiniPak 1412 Supplier Device Package

Applications


There are a lot of Broadcom Limited
HMPP-3892-TR1 applications of RF diodes.

  • Ultra high-speed switching
  • Clamping circuits
  • Diode ring mixer
  • RF detector
  • RF voltage doubler
  • Wearables
  • Smart metering
  • Set top boxes
  • RF attenuators and switches
  • Low-loss, high-power limiters
产品属性
全选
包装: 卷带(TR)
部件状态: 停产
二极管类型: PIN - 2 个独立
最大峰值反向电压: 100V
电流 - 最大值: 1 A
Vr 时的电容,F: 0.3pF @ 5V,1MHz
正向电流时的电阻,频率: 2.5 欧姆 @ 5mA,100MHz
工作温度: 150°C(TJ)
封装/外壳: 0505(1412 公制)
供应商器件封装: MiniPak 1412
Broadcom Limited

Broadcom Limited

Broadcom Limited是一家全球领先的半导体公司,专注于设计、开发和供应广泛的半导体和基础设施软件解决方案。公司总部位于美国加利福尼亚州圣何塞

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