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HCPL-7510

Broadcom HCPL-7510

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HCPL-7510
IC OPAMP ISOLATION 1 CIRC 8DIP
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¥27.00

价格更新:一个月前

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产品详情

Overview

The HCPL-7510 isolattion amplifier, linear current sensing IC is designed for current sensing in low-power electronic motor or servo drive applications. In a typical implementation, motor current flows through an external resistor and the resulting analog voltage drop is sensed by the HCPL-7510. An output voltage is created on the other side of the HCPL-7510 optical isolation barrier. The single-ended output voltage is proportional to the motor current. Since common-mode votlage swings of several hundred volts in tens of nanoseconds are common in modern switching inverter motor drives, the HCPL-7510 was designed to ignore very high common-mode transient slew rates (of at least 10 kV/µs).

The current sensor can also be used for general analog signal isolation applications. For general applications, we recommend the HCPL-7510 (gain tolerance of±3%). The HCPL-7510 utilizes Sigma-Deltaanalog-to-digital converter technology to delivery offset and gain accuracy and stability over time and temperature. This performance is delivered in a compact, auto-insert, industry standard 8-pin DIP package that meets worldwide regulatory safety standards. (A gull-wing surface mount option #300 is also available).

Features

Tube Package
supply voltage of 5V

Through Hole Mounting Type

Applications


There are a lot of Broadcom Limited
HCPL-7510 Instrumentational OP Amps applications.

  • Logarithmic operation circuits
  • Exponential operation circuits
  • Multiplication circuits
  • Division circuits
  • Precision measurement
  • Power control
  • Information processing
  • Weak signal detection
  • Signal amplification
  • Signal filtering
产品属性
全选
包装: 管件
部件状态: 在售
放大器类型: 隔离
电路数: 1
截止频率: 100 kHz
电流 - 输入偏置: 600 nA
输入失调电压: 600 µV
电流 - 供电: 11.7mA
电流 - 输出/通道: 16 mA
最低电源跨距电压: 4.5 V
最大供电跨距电压: 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 通孔
封装/外壳: 8-DIP(0.300",7.62mm)
供应商器件封装: 8-DIP
Broadcom Limited

Broadcom Limited

Broadcom Limited是一家全球领先的半导体公司,专注于设计、开发和供应广泛的半导体和基础设施软件解决方案。公司总部位于美国加利福尼亚州圣何塞

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