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XCZU5EV-1SFVC784E

AMD XCZU5EV-1SFVC784E

MCU,FPGA带 CoreSight™ 的四核 ARM® Cortex®-A53 MPCore™,带 CoreSight™ 的双核 ARM®Cortex™-R5,ARM Mali™-400 MP2256KBDMA,WDTCANbus,EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG500MHz,600MHz,1.2GHz

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AMD
XCZU5EV-1SFVC784E
IC SOC CORTEX-A53 784FCBGA
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¥1872.00

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The Xilinx® UltraScale™ architecture is the first ASIC-class All Programmable architecture to enable multi-hundred gigabit-per-second levels of system performance with smart processing, while efficiently routing and processing data on-chip. UltraScale architecture-based devices address a vast spectrum of high-bandwidth, high-utilization system requirements by using industry-leading technical innovations, including next-generation routing, ASIC-like clocking, 3D-on-3D ICs, multiprocessor SoC (MPSoC) technologies, and new power reduction features. The devices share many building blocks, providing scalability across process nodes and product families to leverage system-level investment across platforms.

Virtex UltraScale devices provide the greatest performance and integration at 20 nm, including serial I/O bandwidth and logic capacity. As the industry's only high-end FPGA at the 20 nm process node, this family is ideal for applications including 400G networking, large scale ASIC prototyping, and emulation.

Features

Zynq® UltraScale+™ MPSoC EV Series
256KB RAM.
Built on MCU, FPGA.

0°C ~ 100°C (TJ) Operating Temperature

Applications


XCZU5EV-1SFVC784E System On Chip (SoC) applications.

  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
产品属性
全选
型号系列: Zynq® UltraScale+™ MPSoC EV
包装: 托盘
部件状态: 在售
系统架构: MCU,FPGA
核心处理器: 带 CoreSight™ 的四核 ARM® Cortex®-A53 MPCore™,带 CoreSight™ 的双核 ARM®Cortex™-R5,ARM Mali™-400 MP2
RAM 大小: 256KB
外设: DMA,WDT
连接能力: CANbus,EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
速度: 500MHz,600MHz,1.2GHz
主要属性: Zynq®UltraScale+™ FPGA,256K+ 逻辑单元
工作温度: 0°C ~ 100°C(TJ)
封装/外壳: 784-BFBGA,FCBGA
供应商器件封装: 784-FCBGA(23x23)
AMD

AMD

Advanced Micro Devices (AMD)是一家全球领先的半导体公司,专注于开发高性能计算和图形处理解决方案。公司成立于1969年,总部位于美国加利福尼亚州圣克拉拉。AMD的产品广泛应用于个人计算机、数据中心、游戏和嵌入式系统等领域。

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