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XCZU3CG-2SFVC784E

AMD XCZU3CG-2SFVC784E

MCU,FPGA带 CoreSight™ 的双核 ARM® Cortex®-A53 MPCore™,带 CoreSight™ 的双核 ARM® Cortex™-R5256KBDMA,WDTCANbus,EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG533MHz,1.3GHz

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XCZU3CG-2SFVC784E
IC SOC CORTEX-A53 784FCBGA
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¥8330.00

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

The Xilinx® Zynq® UltraScale+™ MPSoCsare available in -3, -2, -1 speedgrades, with -3E devices having the highest performance. The -2LE and -1LI devices can operate at a VCCINTvoltage at 0.85V or 0.72V and are screened for lower maximum static power. When operated at VCCINT= 0.85V, using -2LE and -1LI devices, the speed specification for the L devices is the same as the -2I or -1I speed grades. When operated at VCCINT= 0.72V, the -2LE and -1LI performance and static and dynamic power is reduced.

DC and AC characteristics are specified in extended (E), industrial (I), and expanded (Q) temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade extended device are the same as for a -1 speed grade industrial device). However, only selected speed grades and/or devices are available in each temperature range.

Features

Zynq® UltraScale+™ MPSoC CG Series
256KB RAM.
Built on MCU, FPGA.

0°C ~ 100°C (TJ) Operating Temperature

Applications


XCZU3CG-2SFVC784E System On Chip (SoC) applications.

  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
产品属性
全选
型号系列: Zynq® UltraScale+™ MPSoC CG
包装: 散装
部件状态: 在售
系统架构: MCU,FPGA
核心处理器: 带 CoreSight™ 的双核 ARM® Cortex®-A53 MPCore™,带 CoreSight™ 的双核 ARM® Cortex™-R5
RAM 大小: 256KB
外设: DMA,WDT
连接能力: CANbus,EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
速度: 533MHz,1.3GHz
主要属性: Zynq®UltraScale+™ FPGA,154K+ 逻辑单元
工作温度: 0°C ~ 100°C(TJ)
封装/外壳: 784-BFBGA,FCBGA
供应商器件封装: 784-FCBGA(23x23)
AMD

AMD

Advanced Micro Devices (AMD)是一家全球领先的半导体公司,专注于开发高性能计算和图形处理解决方案。公司成立于1969年,总部位于美国加利福尼亚州圣克拉拉。AMD的产品广泛应用于个人计算机、数据中心、游戏和嵌入式系统等领域。

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配件发货: 25M+

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