ADI 3B30-CUSTOM

托盘

Overview

The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system.It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, andconvert the inputs to standardized analog outputs compatible with high level analog I/O subsystems.

Each backplane contains the provision for a subsystem power supply.The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power.Two LEDs are used to indicate that power is being applied.

Features